By Matt Mazur · Last updated April 15, 2022
: This update (released late 2019/2020) is a complete overhaul of the original 2011 standard, adding state-of-the-art guidance on thermal pad design and solder mask defined pads to prevent common defects like solder voiding. Accessing the Standard
The IPC-7093A standard is protected by copyright law and must be purchased through authorized channels. It is available in various formats, including hard copy and secure electronic PDF. Authorized Platforms for Purchase ipc-7093a pdf
The large central pad on a BTC is primarily designed for heat dissipation. IPC-7093A details how to implement thermal vias within this pad without causing assembly defects. : This update (released late 2019/2020) is a
The , titled "Design and Assembly Process Implementation for Bottom Termination Components (BTCs)," is the definitive, industry-recognized guide for addressing these challenges. Released as an update to the original 2011 standard, Revision A (October 2020) provides crucial, state-of-the-art guidance on optimizing BTCs for reliability and manufacturability. Authorized Platforms for Purchase The large central pad