defines the technical requirements for making and testing solderless press-in (press-fit) connections in electronic equipment. iTeh Standards Core Purpose and Scope
Typically a minimum of 25 µm along the hole wall to prevent cracking during insertion. iec 60352-5 pdf
Post diagonal should be ≥ 1.2 × wire diameter to avoid excessive stress concentration. defines the technical requirements for making and testing
Solderless wound connections (also known as "wire-wrap" or "termination wrapping") are fundamental in electromagnetic components. Unlike soldered joints, which introduce thermal stress and potential for cold joints, or crimped connections, which require specialized tooling for each wire size, the wound connection relies entirely on controlled tensile stress and gas-tight contact zones. IEC 60352-5 standardizes this process to ensure reproducibility across manufacturing environments. or crimped connections